XCVU13P system-on-module
UltraScale+ SOM on a 70×70 mm board-to-board footprint. Brings out all 600+ IOs, with carrier design guide and impedance conclusions to cut your board cycle.
Prices vary with exchange rate and chip supply; formal quote per contract. Volume orders may apply for sample loan first, credited against payment after verification.
- Device
- AMD XCVU13P-2FFGA2104
- Logic cells
- 3,780K LE / 94.5 Mb BRAM / 1,228 DSP
- High-speed I/O
- PCIe · DDR4 · FMC
- Delivery
- Lead time 3 weeks
| FPGA 器件 | XCVU13P-2FFGA2104 |
|---|---|
| 板载内存 | 4 × DDR4-2400 8 GB，合计 32 GB |
| 连接器 | 2 × SEARAY 高速连接器，480 组差分对 |
| 供电 | 5V 输入，板上多相供电与 PMBus 监控 |
| 板卡尺寸 | 100 × 100 mm，板对板高度 8 mm |
| 工作温度 | 0 ℃ ~ 70 ℃（工业级可定制） |
| 配套 | 载板设计指南、引脚分配表、散热参考设计 |
I/O and resources exposed on this board. Pin-level definitions are in the bundled XDC and pinout.
- IOSEARAY 连接器 J1/J2 全部 IO 引出
- IO4 通道 DDR4 就近布置，阻抗已仿真
- IO板载 200MHz 差分晶振与可编程时钟
- IOPMBus 读取电压、电流、温度
- IO散热器安装孔与背板支撑柱
Reference designs
- 载板参考设计（Altium）
- DDR4 初始化与校准
- 高速连接器 SI 仿真报告
Rows marked "Request" have no file yet and will be sent after sales approval; uploaded PDFs/ZIPs download directly.
Unit price 23,800 RMB, bulk (10+) 21,500 RMB; price includes 13% VAT, excludes shipping.
Lead time 3 weeks
Standard MOQ 2 pcs; engineering samples available for loan.
12 months on board and SOM, 6 months on accessories; free repair or replacement for non-human damage.
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